Semiconductor devices with guard rings

ABSTRACT

Semiconductor devices with guard rings are described. The semiconductor devices may be, e.g., transistors and diodes designed for high-voltage applications. A guard ring is a floating electrode formed of electrically conducting material above a semiconductor material layer. A portion of an insulating layer is between at least a portion of the guard ring and the semiconductor material layer. A guard ring may be located, for example, on a transistor between a gate and a drain electrode. A semiconductor device may have one or more guard rings.

CROSS-REFERENCE TO RELATED APPLICATION

This is a divisional application of U.S. application Ser. No.13/226,380, filed Sep. 6, 2011, the disclosure of which is herebyincorporated by reference in its entirety.

TECHNICAL FIELD

This invention relates to semiconductor electronic devices, specificallydevices with guard rings.

BACKGROUND

To date, most transistors used in power electronic applications havetypically been fabricated with silicon (Si) semiconductor materials.Common transistor devices for power applications include Si CoolMOS, SiPower MOSFETs, and Si Insulated Gate Bipolar Transistors (IGBTs). WhileSi power devices are inexpensive, they suffer from a number ofdisadvantages, including relatively low switching speeds and high levelsof electrical noise. More recently, silicon carbide (SiC) power deviceshave been considered due to their superior properties. III-Nitride(III-N) semiconductor devices are now emerging as an attractivecandidate to carry large currents and support high voltages, and providevery low on resistance, high voltage device operation, and fastswitching times. A typical III-N high electron mobility transistor(HEMT), shown in FIG. 1, comprises a substrate 10, a III-N channel layer11, such as a layer of GaN, atop the substrate, and a III-N barrierlayer 12, e.g., a layer of Al_(x)Ga_(1-x)N, atop the III-N channellayer. A two-dimensional electron gas (2DEG) channel 19 is induced inthe III-N channel layer 11 near the interface between the III-N channellayer 11 and the III-N barrier layer 12. Source and drain electrodes 14and 15, respectively, form ohmic contacts to the 2DEG channel. Gate 16modulates the portion of the 2DEG in the gate region, e.g., beneath gate16.

In typical power switching applications for which high-voltage switchingtransistors are used, the transistor may be in one of two states. In thefirst state, which is commonly referred to as the “on state”, thevoltage at the gate electrode relative to the source electrode is higherthan the transistor threshold voltage, and substantial current flowsthrough the transistor. In this state, the voltage difference betweenthe source and drain is typically low, usually no more than a few volts,e.g., about 0.1-5 volts. In the second state, which is commonly referredto as the “off state”, the voltage at the gate electrode relative to thesource electrode is lower than the transistor threshold voltage, and nosubstantial current flows through the transistor. In this second state,the voltage between the source and drain can range anywhere from about0V to the value of the circuit high voltage supply, which in some casescan be as high as 100V, 300V, 600V, 1200V, 1700V, or higher. When thetransistor is in the off state, it is said to be “blocking a voltage”between the source and drain. As used herein, “blocking a voltage”refers to the ability of a transistor, diode, device, or component toprevent significant current, e.g., current that is greater than 0.001times the operating current during regular conduction, from flowingthrough the transistor, diode, device, or component when a voltage isapplied across the transistor, diode, device, or component. In otherwords, while a transistor, diode, device, or component is blocking avoltage that is applied across it, the total current passing through thetransistor, diode, device, or component will not be greater than 0.001times the operating current during regular conduction.

When a device is operated in the off-state, large electric fields may bepresent in the material layers, especially when the device is ahigh-voltage device and is used in high-voltage applications. As usedherein, a “high-voltage device”, such as a high-voltage transistor ordiode, is an electronic device which is optimized for high-voltageswitching applications. That is, in the case the device is ahigh-voltage transistor, when the transistor is off, it is capable ofblocking high voltages, such as about 100V or higher, about 300V orhigher, about 600V or higher, about 1200V or higher, or about 1700V orhigher, and when the transistor is on, it has a sufficiently lowon-resistance (R_(ON)) for the application in which it is used, i.e., itexperiences sufficiently low conduction loss when a substantial currentpasses through the device. In the case the device is a high-voltagediode, when the diode is reverse biased, it is capable of blocking highvoltages, such as about 100V or higher, about 300V or higher, about 600Vor higher, about 1200V or higher, or about 1700V or higher, and when thediode is forward biased, it has a sufficiently low on-resistance R_(ON)or on-voltage VON for the application in which it is used. Ahigh-voltage device may be at least capable of blocking a voltage equalto the high-voltage supply or the maximum voltage in the circuit forwhich it is used. A high-voltage device may be capable of blocking 100V,300V, 600V, 1200V, 1700V, or other suitable blocking voltage required bythe application. In other words, a high-voltage device may be designedto block any voltage between 0V and at least V_(max), where V_(max) isthe maximum voltage that could be supplied by the circuit or powersupply. In some implementations, a high-voltage device can block anyvoltage between 0V and at least 2*V_(max).

Field plates are commonly used in high-voltage devices to shape theelectric field in the high-field region of the device in such a way thatreduces the peak electric field and increases the device breakdownvoltage, thereby allowing for higher voltage operation. In afield-effect transistor (FET), the high-field region in the device isprimarily in the access region between the gate and the drain, e.g.,region 24 in FIG. 3. Hence, the field plate in a FET is typically placedon top of the portion of the drain access region adjacent to thedrain-side edge of the gate, as seen in FIGS. 2 and 3. As used herein,the “access regions” of a transistor refer to the regions between thesource and gate electrodes and between the gate and drain electrodes ofthe transistor, e.g., regions 23 and 24 indicated in FIG. 3. Region 23,the access region on the source side of the gate, is typically referredto as the source access region, and region 24, the access region on thedrain side of the gate, is typically referred to as the drain accessregion. As used herein, the “gate region” of a transistor refers to theportion of the transistor between the two access regions, e.g., region25 in FIG. 3.

Examples of field plated III-N HEMTs are shown in FIGS. 2 and 3. Inaddition to the layers included in the device of FIG. 1, the device inFIG. 2 includes a field plate 18 which is connected to gate 16, and aninsulator layer 13 (e.g., a layer of SiN) that is at least partiallybetween the field plate and the barrier layer 12. Field plate 18 caninclude or be formed of the same material as gate 16, or it canalternatively be formed of a different conducting material or layer.Insulator layer 13 can act as a surface passivation layer, preventing orsuppressing voltage fluctuations at the surface of the III-N materialadjacent to insulator layer 13. FIG. 3 shows an example of a III-N HEMTwith a slant field plate. The device of FIG. 3 is similar to that ofFIG. 2, except that the insulator layer 13 includes a slanted edge 26 onthe drain side of the gate, and the field plate 28 is on top of andcontacting the slanted edge 26; hence the field plate 28 is referred toas a slant field plate. The slanted edge 26 includes at least asubstantial portion which is at a non-perpendicular angle to a mainsurface of the semiconductor material structure 32. Alternative fieldplate structures to those shown in FIGS. 2 and 3 have also been used.

In order for a field plate to effectively minimize the peak electricfield when the device is blocking a voltage, it is electricallyconnected to a supply of mobile charge, which is typically accomplishedby electrically connecting the field plate to the gate electrode, asshown in FIGS. 2-3, or in some cases by electrically connecting thefield plate to the source electrode. As used herein, two or morecontacts or other elements such as conductive layers or components aresaid to be “electrically connected” if they are connected by a materialwhich is sufficiently conducting so that the electric potential at eachof the contacts or other elements will be similar, e.g., about the sameor substantially the same, after a period of time. Elements which arenot electrically connected are said to be “electrically isolated”.Electrically isolated elements, although not maintained at substantiallythe same potential at all times, can be capacitively or inductivelycoupled.

While field plates have been shown to enable III-N HEMTs with very largebreakdown voltages, they can cause an increase in the input capacitance(gate capacitance) of the transistor, resulting in slower transistorspeeds and, in the case of power switching applications, larger gatecurrents during switching. In order to enable devices with even higheroperating voltages and/or breakdown voltages than those which arecurrently possible with modern field plate structures, as well asimproving other aspects of device performance, additional improvementsin device design are necessary.

SUMMARY

Semiconductor devices with guard rings are described. The semiconductordevices may be, e.g., transistors and diodes designed for high-voltageapplications. A guard ring is a floating electrode formed ofelectrically conducting material above a semiconductor material layer. Aportion of an insulating layer is between a portion of the guard ringand the semiconductor material layer. A guard ring may be located, forexample, on a transistor between a gate and a drain electrode. Asemiconductor device may have one or more guard rings.

In one aspect, a semiconductor transistor is described. The transistorincludes a semiconductor material layer, a conductive channel in thesemiconductor material layer, a source electrode and a drain electrodecontacting the conductive channel, a gate between the source electrodeand the drain electrode, an insulating layer on a surface of thesemiconductor material layer, and a guard ring above the semiconductormaterial layer and between the gate and the drain electrode. The guardring includes or is formed of an electrically conductive material whichis electrically isolated from the source electrode, the drain electrode,and the gate. A portion of the insulating layer is between at least aportion of the guard ring and the semiconductor material layer.

In another aspect, a semiconductor diode is described. The diodeincludes a semiconductor material layer, a conductive channel in thesemiconductor material layer, a cathode, and an anode. The cathodecontacts the conductive channel. The diode further includes aninsulating layer on a surface of the semiconductor material layer and aguard ring above the semiconductor material layer and between thecathode and the anode. The guard ring includes or is formed of anelectrically conductive material which is electrically isolated from thecathode and the anode.

The transistors and diodes described herein can include one or more ofthe following. The guard ring can include a field mitigating portion.The field mitigating portion can include or be formed of electricallyconductive material extending from the guard ring towards the drainelectrode or the cathode. The guard ring can include a main portionextending from a top of the insulating layer towards a bottom of theinsulating layer, with the field mitigation portion substantiallyperpendicular to the main portion and extending from the main portiontowards the drain electrode. The field mitigating portion can be formedon top of first and second separating portions of the insulating layer,and where the first separating portion is narrower than the secondseparating portion. The field mitigating portion can be slanted, beingformed around a via in the insulating layer that is narrower towards thebottom of the insulating layer and wider towards the top of theinsulating layer. The semiconductor transistor or diode can furtherinclude one or more additional guard rings between the guard ring andthe drain electrode or the cathode. The guard ring may not beelectrically connected to (i.e., may be electrically isolated from) anyDC and/or AC voltage sources. The guard ring can extend from a top ofthe insulating layer towards a bottom of the insulating layer withoutcontacting the semiconductor material layer. The minimum separationbetween the guard ring and the semiconductor material layer can be atleast 20 nanometers. The guard ring can extend from a top of theinsulating layer towards a bottom of the insulating layer and contactthe semiconductor material layer. The guard ring can be a distance fromthe gate or the anode where a depletion region in the semiconductormaterial layer extends prior to or at breakdown of the transistor ordiode in a similar transistor or diode which lacks the guard ring. Thetransistor or diode can further include a field plate. The field platecan be electrically connected to the gate or the anode. The field platecan include or be formed of electrically conducting material contactingthe gate or anode and extending from the gate or anode towards the drainelectrode or the cathode. The field plate can be slanted, being formedaround a via in the insulating layer that is narrower towards a bottomof the insulating layer and wider towards a top of the insulating layer.The transistor or diode can be a III-N device. The semiconductormaterial layer can include a III-N channel layer and a III-N barrierlayer above the III-N channel layer. The conductive channel can be atwo-dimensional electron gas (2DEG) channel induced in the III-N channellayer near the interface between the III-N channel layer and the III-Nbarrier layer. The III-N channel layer can include a layer of GaN. TheIII-N barrier layer can include a layer of Al_(x)Ga_(1-x)N. Thetransistor or diode can be a high-voltage device.

In yet another aspect, a method of manufacturing a semiconductortransistor is described. The method includes forming a semiconductormaterial layer on a substrate, forming an insulating layer on top of thesemiconductor material layer, adding source and drain electrodescontacting a conductive channel in the semiconductor material layer,etching the insulating layer to receive a deposition of conductivematerial, and depositing conductive material to form a gate between thesource electrode and the drain electrode and a guard ring between thegate and the drain electrode. The guard ring is electrically isolatedfrom the source electrode, the drain electrode, and the gate, and aportion of the insulating layer is between at least a portion of theguard ring and the semiconductor material layer.

In still another aspect, a method of manufacturing a semiconductor diodeis described. The method includes forming a semiconductor material layeron a substrate, forming an insulating layer on top of the semiconductormaterial layer, and adding a cathode and an anode. The cathode contactsa conductive channel in the semiconductor material layer. The methodfurther includes etching the insulating layer to receive a deposition ofconductive material, and depositing conductive material to form a guardring between the cathode and the anode, such that the guard ring iselectrically isolated from the cathode and the anode.

Methods of manufacturing semiconductor transistors or diodes can includeone or more of the following. Etching the insulating layer can includeetching the insulating layer so that the guard ring is a distance fromthe gate or anode where a depletion region in the semiconductor materiallayer extends prior to or at breakdown of the transistor or diode in asimilar transistor or diode which lacks the guard ring. Etching theinsulating layer can include etching the insulating layer to define aguard ring including a field mitigating portion extending from the guardring towards the drain electrode or the cathode. The field mitigatingportion can include a plurality of perpendicular field mitigatingportions between the top of the insulating layer and the bottom of theinsulating layer, each perpendicular field mitigating portion extendingperpendicularly from the main portion towards the drain electrode. Thefield mitigating portion can be slanted, being formed around a via inthe insulating layer that is narrower towards the bottom of theinsulating layer and wider towards the top of the insulating layer.Etching the insulating layer can include etching the insulating layer todefine one or more additional guard rings between the guard ring and thedrain electrode or the cathode. Etching the insulating layer can includeetching the insulating layer to define a field plate. The methods canfurther include depositing conductive material so that the field plateis electrically connected to the gate or the anode. Forming thesemiconductor material layer can include forming a III-N channel layerand a III-N barrier layer above the III-N channel layer. The guard ringmay not be electrically connected to (i.e., may be electrically isolatedfrom) any DC and/or AC voltage sources.

Particular embodiments of the subject matter described in thisspecification can be implemented so as to realize one or more of thefollowing advantages. Semiconductor devices including guard rings mayhave increased breakdown voltages. The breakdown voltage of asemiconductor device may be increased without increasing the capacitanceof the device at lower voltages. Semiconductor devices with higherbreakdown voltages may be manufactured in fewer steps.

The details of one or more embodiments of the subject matter describedin this specification are set forth in the accompanying drawings and thedescription below. Other features, aspects, and advantages of thesubject matter will become apparent from the description, the drawings,and the claims.

DESCRIPTION OF DRAWINGS

FIG. 1 illustrates a III-N high electron mobility transistor.

FIG. 2 illustrates a III-N high electron mobility transistor including afield plate.

FIG. 3 illustrates a III-N high electron mobility transistor including aslant field plate.

FIG. 4 is a schematic overhead view of an example transistor including aguard ring.

FIG. 5 is a schematic cross-sectional view of an example transistorincluding a first example guard ring.

FIG. 6 is a schematic cross-sectional view of an example transistorincluding a second example guard ring.

FIG. 7 is a schematic cross-sectional view of an example transistorincluding a third example guard ring.

FIG. 8 is a schematic cross-sectional view of an example transistorincluding a fourth example guard ring.

FIGS. 9-10 illustrate a depletion region in an example transistor.

FIG. 11 is a flow diagram of a process for manufacturing a transistorincluding a guard ring.

FIGS. 12-13 illustrate an example diode that includes a guard ring.

FIG. 14 is a flow diagram of a process for manufacturing a diodeincluding a guard ring.

Like reference symbols in the various drawings indicate like elements.

DETAILED DESCRIPTION

FIGS. 4-8 illustrate example transistors 1 that include a sourceelectrode 14, a drain electrode 15, source and drain access regions 23and 24, a gate region 25, a gate 16 in the gate region 25 between thesource electrode 14 and the drain electrode 15, a guard ring (labeled 33in FIGS. 4 and 5, 33′ in FIG. 6, 33″ in FIG. 7, and 33′″ in FIG. 8) inthe drain access region 24 between the gate 16 and the drain electrode15, and optionally a field plate 48 which is in the drain access region24 and is electrically connected to the gate 16, or alternatively can beelectrically connected to the source electrode 14.

The transistor 1 may be a lateral device, a III-N device, anenhancement-mode device (threshold voltage >0V), a depletion-mode device(threshold voltage <0V), a high-voltage device, or any combination ofthese devices. III-N devices may be III-polar (III-face) devices,N-polar (N-face) devices or semipolar devices. A Ga-face, III-face orIII-polar III-N device may include III-N materials grown with a groupIII-face or a [0 0 0 1] face furthest from the growth substrate, or mayinclude source, gate, or drain electrodes on a group III face or [0 0 01] face of the III-N materials. A nitrogen-face, N-face or N-polar III-Ndevice may include III-N materials grown with an N-face or [0 0 0 1 bar]face furthest from the growth substrate, or may include source, gate, ordrain electrodes on an N-face or [0 0 0 1 bar] face of the III-Nmaterials.

Various conventional III-N high electron mobility transistors (HEMTs)and related transistor devices are normally on, e.g., have a negativethreshold voltage, which means that they can conduct current at zerogate voltage. These devices with negative threshold voltages are knownas depletion-mode (D-mode) devices. It may be useful in powerelectronics to have normally off devices, e.g., devices with positivethreshold voltages, that cannot conduct current at zero gate voltage.For example, normally off devices may be useful to avoid damage to thedevice or to other circuit components by preventing accidental turn onof the device. Normally off devices are commonly referred to asenhancement-mode (E-mode) devices.

Guard ring 33 is formed of a conducting material, e.g., nickel,titanium, platinum, gold, aluminum, poly-silicon, or another metal orother conducting material, or a combination of various conductingmaterials. Guard ring 33 may be formed of the same conducting materialas the gate 16. Guard ring 33 is a floating electrode—it is notelectrically connected to (i.e., it is electrically isolated from) thesource electrode 14, the drain electrode 15, and the gate 16. Ingeneral, guard ring 33 is not electrically connected to any DC or ACvoltage source, or to a DC or AC ground.

FIGS. 4-8 illustrate various example configurations of the guard ring33. In FIGS. 4-8, guard ring 33 is positioned in transistor 1 so that atleast a portion of an insulating layer 13 is between at least a portionof the guard ring 33 and the semiconductor material layer 12. A portionof the insulating layer 13 is also between at least a portion of theguard ring 33 and the conducting 2DEG channel 19. The portion ofinsulating layer 13 between guard ring 33 and semiconductor materiallayer 12 (or between guard ring 33 and conducting 2DEG channel 19) isuseful, for example, in that it can allow for the guard ring 33 toinclude a field mitigating portion, as described below, which canprevent material near the guard ring 33 from breaking down during highvoltage operation of the transistor 1.

During operation of transistor 1, guard ring 33 shapes the electricfield in transistor 1 to reduce the peak electric field and increase thedevice breakdown voltage, thereby allowing for higher voltage operation.Consider an example scenario where transistor 1 is off (i.e., thevoltage applied to the gate 16 relative to the source 14 is less thanthe threshold voltage of the device) and an applied voltage acrosssource 14 and drain 15 is increased over time. When the appliedsource-drain voltage is small (e.g., substantially less than thebreakdown voltage of transistor 1), as illustrated in FIG. 9, nosubstantial current flows between source 14 and drain 15 because thetransistor is off. A depletion region 40 exists below gate 16 (e.g., in2DEG channel 19), and the 2DEG channel below the gate is substantiallydepleted of carriers. Under this bias condition, the voltage of theguard ring 33 is approximately the same as the voltage on the drain 15.As shown in FIG. 10, as the applied drain-source voltage increases, thedepletion region extends towards guard ring 33, and the voltage of theguard ring 33 (relative to the source) increases so that the guard ringvoltage remains close to or approximately equal to the drain voltage.The peak electric field in the semiconductor material layers alsoincreases. The peak electric field does, however, stay below thebreakdown field of the device semiconductor layers.

When the applied source-drain voltage is increased such that thedepletion region extends all the way to guard ring 33, the voltage ofguard ring 33 is clamped. That is, the voltage of the guard ring 33remains about the same even as the applied source-drain voltage isfurther increased. Furthermore, as the applied source-drain voltage isfurther increased, the depletion region continues to extend towardsdrain 15, and charge on the guard ring 33 redistributes such that thereis a net negative charge on the surface close to the depletion regionand net positive charge on other surfaces of guard ring 33. Thisredistribution of charge causes the electric field profile in the devicesemiconductor layers to be modified, and can cause a reduced peakelectric field in transistor 1 as compared to a similar device whichlacks a guard ring. As a result, the breakdown voltage of the transistor1 can be larger as a result of inclusion of the guard ring 33.

In general, the net charge on the guard ring 33 remains constant duringdevice operation. That is, no net charge is transferred to or from theguard ring 33 during device operation; instead, charge redistributeswithin or along the surface of the guard ring 33. However, if a portionof the guard ring 33 contacts the underlying semiconductor material (forexample layer 12 in FIGS. 6-8), then net charge may be transferred to orfrom the guard ring 33 during device operation. For example, when thetransistor 1 in FIGS. 6-8 is biased in the off state with a sufficientlylarge drain-source voltage to cause the depletion region 40 (shown inFIGS. 9-10) to extend underneath the guard ring 33, electrons from thetransistor channel 19 may leak or be injected into (or onto the surfaceof) the guard ring 33. Charge transfer in this manner may also occur instructures where the guard ring does not directly contact the underlyingsemiconductor material, but the separation between the guard ring andsemiconductor material is small. For example, in the structure of FIG.5, if region 27 of insulating layer 13 is thin, such as less than 100nanometers, less than 50 nanometers, less than 20 nanometers, less than10 nanometers, less than 5 nanometers, or less than 2 nanometers, chargetransfer as described above may occur. On the other hand, if the minimumseparation between the guard ring 33 and the underlying semiconductorlayer is sufficiently large, such as greater than 10 nanometers, greaterthan 20 nanometers, greater than 50 nanometers, greater than 100nanometers, greater than 1 micron, or greater than 2 microns, thencharge transfer to or from the guard ring 33 may be suppressed and/oreliminated. The minimum separation required to suppress and/or eliminatecharge transfer may depend on a number of factors, including the exactconfiguration of the guard ring 33, and the material composition(s) ofthe guard ring, the underlying semiconductor material, and/or thematerial between the guard ring and the underlying semiconductormaterial.

Charge transfer into or onto the guard ring 33 during off-stateoperation, as described above, may degrade device performance, since itcan lead to undesirable effects such as dispersion (for example,DC-to-RF dispersion) or increased switching times. For example, if thecharge transferred into the guard ring 33 when the transistor 1 isbiased in the off-state is not quickly removed or transferred out of theguard ring 33 when the gate voltage of transistor 1 is switched from lowto high, the transistor 1 will not be immediately switched into theon-state. Rather, some amount of time (referred to as the transistorswitching time) will elapse after the gate voltage is switched from lowto high, during which time the guard ring 33 is discharged. Largeswitching times can lead to higher switching losses in the devices, aswell as other undesirable effects.

When the applied source-drain voltage is large enough to cause thevoltage at guard ring 33 to clamp, guard ring 33 can act like a fieldplate, reducing the peak electric field in transistor 1. Like a fieldplate, the entire guard ring 33 is at substantially uniform potential,which can result in a reduced peak electric field in the transistor 1.However, in many cases, no net charge is transferred to or from guardring 33, unlike in a field plate. Because the peak electric field in thematerial layers of transistor 1 is reduced, the breakdown voltage oftransistor 1 is increased.

Referring again to FIGS. 9 and 10, before the depletion region extendsall the way to guard ring 33, the voltage at guard ring 33 issubstantially the same as the voltage at drain 15, and transistor 1operates as though it would without a guard ring. That is, the electricfield distribution within the device material layers is substantiallythe same as that of a device lacking the guard ring but otherwiseidentical to the one illustrated. Furthermore, before the depletionregion extends to guard ring 33 and while the voltage at guard ring 33is substantially the same as the voltage at drain 15, guard ring 33 doesnot substantially alter the gate capacitance of transistor 1. This isuseful, for example, because guard ring 33 can increase the breakdownvoltage of transistor 1 without changing its capacitance (e.g., as somefield plates do) during times where the applied source-drain voltage totransistor 1 is below the voltage that causes the depletion region toextend to guard ring 33. Increased capacitance may degrade performanceof transistor 1 or the circuit in which it is used, e.g., in higherfrequency or high power switching applications.

When the applied voltage exceeds the voltage that causes the depletionregion to extend to guard ring 33, guard ring 33 may alter the gatecapacitance of transistor 1 in much the same way that inclusion of afield plate increases the gate capacitance of a transistor. The guardring 33 therefore offers the following advantages as compared to a fieldplate. During the times that the transistor is biased off and supportslarge source-drain voltages, the guard ring reduces the peak electricfield in the device and prevents breakdown of the device, similar to afield plate. However, during times where the source-drain voltage issmall (that is, small enough so that the depletion region does notextend all the way to the guard ring), the gate capacitance of thetransistor is smaller, which can result in higher switching speeds andlower switching losses.

In some implementations, guard ring 33 is placed between gate 16 anddrain 15 at a specific location so that the depletion region in thechannel during off-state operation extends to guard ring 33 at orslightly below the breakdown voltage of a similar transistor which lacksa guard ring 33. For example, the distance from gate 16 where thedepletion region extends when a transistor which lacks a guard ringbreaks down may be determined using analytical methods or testing.Transistor 1 is then formed by placing a guard ring 33 at or before(e.g., slightly before) that distance from gate 16.

FIG. 4 is a schematic overhead view of an example transistor 1 includinga guard ring 33. FIG. 4 illustrates source electrode 14, drain electrode15, source and drain access regions 23 and 24, gate region 25, gate 16,field plate 48, and guard ring 33.

FIG. 5 is a schematic cross-sectional view of an example transistor 1including a first example guard ring 33. The transistor 1 includes, forexample, a substrate 10, a III-N channel layer 11, e.g., a layer of GaN,atop the substrate, and a III-N barrier layer 12, e.g., a layer ofAl_(x)Ga_(1-x)N, atop the III-N channel layer. FIGS. 5-8 will bedescribed as though transistor 1 is a III-N device; however, othersemiconductor materials may be used.

A two-dimensional electron gas (2DEG) channel 19 is induced in the III-Nchannel layer 11 near the interface between the III-N channel layer 11and the III-N barrier layer 12. Source and drain electrodes 14 and 15,respectively, form ohmic contacts to the 2DEG channel 19. Substrate 10may include or be formed of, for example, silicon, sapphire, GaN, AlN,SiC, or any other substrate suitable for use in III-N devices. In someimplementations, a substrate is not included. For example, in someimplementations the substrate is removed prior to completion of devicefabrication.

Guard ring 33 includes a main portion extending from a top of insulatinglayer 13 towards a bottom of insulating layer 13 and a field mitigatingportion 38. Guard ring 33 extends towards the bottom of insulating layer13 without contacting semiconductor material layer 12. A separatingportion 27 of insulating layer 13 separates guard ring 33 fromsemiconductor material layer 12. Because guard ring 33 does not contactsemiconductor material layer 12, transistor 1 may, in some applications,be affected by dispersion. In III-N devices, voltage fluctuations atuppermost III-N surfaces, often caused by the charging of surface statesduring device operation, are known to lead to effects such asdispersion. Dispersion refers to a difference in observedcurrent-voltage (I-V) characteristics when the device is operated underRF or switching conditions as compared to when the device is operatedunder DC conditions.

Field mitigating portion 38 includes electrically conductive materialextending from guard ring 33 towards drain electrode 15. Fieldmitigation portion 38 is substantially perpendicular to the mainportion. In operation, field mitigation portion 38 affects transistor 1by shaping the electric field in the high-field region of the device toreduce the peak electric field and increase the device breakdownvoltage, thereby allowing for higher voltage operation.

FIG. 6 is a schematic cross-sectional view of an example transistor 1including a second example guard ring 33′. Guard ring 33′ extends from atop of insulating layer 13 towards a bottom of insulating layer 13 andcontacts semiconductor material layer 12. Because guard ring 33′contacts semiconductor material layer 12, dispersion may be reduced.Guard ring 33′ also includes a gate-side portion extending at the top ofguard ring 33′ towards the gate 14. The gate-side portion may beintentional or a result of alignment error during manufacturing. Guardring 33′ also includes a field mitigating portion 38′ extending over thetop of layer 13 towards the drain 15.

Guard ring 33′ can be formed around a via 39′. Via 39′ extends from thetop of guard ring 33′ towards the semiconductor material layer 12. Via39′ has about the same width towards the top of guard ring 33′ as itdoes towards the semiconductor material layer 12 (e.g., via 39′ hassidewalls that are substantially parallel.) The via 39′ may result, forexample, when the guard ring 33′ is deposited conformally over theinsulating layer 13.

FIG. 7 is a schematic cross-sectional view of an example transistor 1including a third example guard ring 33″. Guard ring 33″ includes a mainportion contacting the semiconductor material layer 12 on a side towardsthe gate 16. Guard ring 33″ includes a field mitigating portion 38″ on aside towards the drain 15. Field mitigating portion 38″ is formed on topof first and second separating portions 27 and 29 of the insulatinglayer 13. The first separating portion 27 is narrower than the secondseparating portion 29. This results in a via 39″ having a step at theend towards the insulating layer 12.

FIG. 8 is a schematic cross-sectional view of an example transistor 1including a fourth example guard ring 33′″. The guard ring includes aslanted field mitigating portion 38′″. The via 39′″ in insulating layer13 in which the guard ring is formed is narrower towards a bottom ofinsulating layer 13 and wider towards a top of insulating layer 13. Atleast one of the sidewalls of via 39′″ is a slanted sidewall. FIG. 8shows the sidewall on the drain side of the via (i.e., the sidewallclosest to the drain 15) as being slanted; however, the sidewall on thegate side of the via may be slanted in addition to or instead of thesidewall on the drain side being slanted. As compared to a guard ringwithout a slanted field-mitigating portion, the slanted field mitigatingportion 38′″ can further reduce the peak field in the device when thedevice is biased such that the channel depletion region extends beyondthe drain-side edge of the guard ring, thereby further increasing thedevice breakdown voltage and improving device reliability.

Features of guard rings shown in FIGS. 5-8 may be used individually orin combination with one another. For example, a guard ring may notdirectly contact the underlying semiconductor materials, as in FIG. 5,but may have a slanted field mitigating portion, as in FIG. 8. Or, aguard ring may include a series of steps, as in FIG. 7, where one ormore of the steps include slanted sidewalls, as in FIG. 8. Othercombinations are possible.

FIG. 11 is a flow diagram of a process 1100 for manufacturing atransistor including a guard ring. The process 1100 may be performed,for example, to create one of the example transistors 1 of FIGS. 4-8.

A semiconductor material layer including a conductive channel is formedon a substrate (step 1102). For example, a series of III-N layersincluding a channel layer and a barrier layer may be formed on thesubstrate, resulting in the formation of a 2DEG in the channel layer.The III-N layers may be grown epitaxially, e.g., by MOCVD, MBE, HVPE, oranother method.

An insulating layer is formed on top of the semiconductor material layer(step 1104). For example, the insulating layer may be grown or depositedby MOCVD, PECVD, high temperature CVD (HTCVD), sputtering, evaporation,or another method. In some embodiments, the insulating layer is formedby a similar or the same method as the semiconductor material layer, andcan be formed in the same step. For example, the semiconductor materiallayer and the insulating layer can all be deposited or grown by MOCVD.

Source and drain electrodes are added to the transistor (step 1106). Thesource and drain electrodes contact the conductive channel in thesemiconductor material layer. For example, the insulating layer may beremoved in regions to receive the source and drain electrodes, and thenthe source and drain electrodes may be formed by evaporation,sputtering, PECVD, HTCVD, or another method. In some implementations,the source and drain electrodes are formed prior to the formation of theinsulating layer. In other implementations, the insulating layerincludes a first portion and a second portion, the first portion beingformed prior to formation of the source and drain electrodes, and thesecond portion being formed after formation of the source and drainelectrodes.

The insulating layer is etched to receive a deposition of conductivematerial (step 1108). The insulating layer is etched to define regionsto receive a gate and one or more guard rings. The gate is between thesource electrode and the drain electrode, and the guard rings arebetween the gate and the drain. In some implementations, the guard ringis a distance from the gate where a depletion region in thesemiconductor material layer would extend prior to or at breakdown ofthe transistor. In some implementations, the insulating layer is etchedto define a region to receive a field plate.

Conductive material is deposited over the insulating layer to form agate and one or more guard rings (step 1110). The guard rings may be,for example, any of the guard rings 33 illustrated in FIGS. 4-8. Eachguard ring is electrically isolated from the source electrode, the drainelectrode, and the gate. At least a portion of the insulating layer isbetween at least a portion of each guard ring and the semiconductormaterial layer. In some implementations, conductive material isdeposited over the insulating layer to form a field plate.

The process 1100 is useful, for example, for producing high-voltagedevices. Instead of adding additional field plates to increase thebreakdown voltage of a transistor, a guard ring or additional guardrings may be added. Adding additional field plates typically requiresadditional depositions, whereas multiple guard rings may be added andformed in a single deposition along with a gate and a field plate

FIGS. 12-13 illustrate an example diode 60 that includes a guard ring33. FIG. 12 is a cross-sectional view of the diode 60, and FIG. 13 is atop view (plan view) of the diode 60. The diode 60 includes, forexample, a substrate 10, a III-N channel layer 11, e.g., a layer of GaN,atop the substrate, and a III-N barrier layer 12, e.g., a layer ofAl_(x)Ga_(1-x)N, atop the III-N channel layer. FIGS. 12-13 will bedescribed as though diode 60 is a III-N device; however, othersemiconductor materials may be used.

A two-dimensional electron gas (2DEG) channel 19, i.e., a conductivechannel, is induced in the III-N channel layer 11 near the interfacebetween the III-N channel layer 11 and the III-N barrier layer 12.Cathode 55 is a single electrode which forms an ohmic contact to the2DEG channel 19. Anode 54 forms a Schottky or rectifying contact withthe semiconductor material which is in direct contact with the anode 54.Substrate 10 may include or be formed of, for example, silicon,sapphire, GaN, AlN, SiC, or any other substrate suitable for use inIII-N devices. In some implementations, a substrate is not included. Forexample, in some implementations the substrate is removed prior tocompletion of device fabrication.

When diode 60 is forward biased, i.e., when the voltage at the anode 54is greater than that at the cathode 55, the anode Schottky or rectifyingcontact is forward biased, and electrons flow from the cathode 55,through the 2DEG 19, and into the anode 54. When diode 60 is reversebiased, i.e., when the voltage at the anode 54 is less than that at thecathode 55, only a small reverse bias current flows between the anode 54and cathode 55, and so the diode blocks the voltage (i.e., the voltagedifference) between the anode and cathode.

Diode 60 also includes a field plate 58. In the implementation shown inFIG. 12, the field plate 58 is connected to the anode 54 and extendsfrom the anode 54 towards the cathode 55 over the top surface ofinsulating layer 13. Other field plate configurations are possible. Thefield plate 58 reduces the peak electric field in the diode duringreverse bias operation, thereby allowing the diode to block largerreverse biases without breaking down. In order for a field plate toeffectively minimize the peak electric field when the diode 60 isreverse biased and blocking a voltage, the field plate is electricallyconnected to a supply of mobile charge, which can be accomplished byelectrically connecting the field plate to the anode, as shown in FIG.12, or in some cases by electrically connecting the field plate to a DCvoltage supply or a DC or AC ground.

A guard ring 33 is included between the anode 54 and cathode 55. Guardring 33 is formed of a conducting material, e.g., nickel, titanium,platinum, gold, aluminum, poly-silicon, or another metal or otherconducting material, or a combination of various conducting materials.Guard ring 33 may be formed of the same conducting material as the anode54. Guard ring 33 is a floating electrode—it is not electricallyconnected to (i.e., it is electrically isolated from) both the anode 54and the cathode 55. In general, guard ring 33 is not electricallyconnected to any DC or AC voltage source, or to a DC or AC ground.

In some implementations, guard ring 33 is positioned in diode 60 so thatat least a portion of an insulating layer 13 is between at least aportion of the guard ring 33 and the semiconductor material layer 12. Aportion of the insulating layer 13 is also between at least a portion ofthe guard ring 33 and the conducting 2DEG channel 19. The portion ofinsulating layer 13 between guard ring 33 and semiconductor materiallayer 12 (or between guard ring 33 and conducting 2DEG channel 19) isuseful, for example, in that it can allow for the guard ring 33 toinclude a field mitigating portion, as described below, which canprevent material near the guard ring 33 from breaking down during highvoltage operation of the diode 60.

In some implementations, guard ring 33 is placed between anode 54 andcathode 55 at a specific location so that the depletion region in thechannel during reverse bias operation extends from the anode 54 to theguard ring 33 at or slightly below the breakdown voltage of a similardiode which lacks a guard ring 33. For example, the distance from anode54 where the depletion region extends when a diode which lacks a guardring breaks down may be determined using analytical methods or testing.Diode 60 is then formed by placing a guard ring 33 at or before (e.g.,slightly before) that distance from anode 54.

The guard ring 33 shown in FIG. 12 includes a main portion whichdirectly contacts or is adjacent to semiconductor material layer 12 andto the 2DEG channel 19. The main portion of the guard ring is placedclose enough to the 2DEG channel 19 such that charge induced on the mainportion during reverse biasing of diode 60 can alter the electric fielddistribution in the underlying semiconductor materials, such as toreduce a peak electric field in the device. The guard ring 33 alsoincludes a field mitigating portion 38 which extends from the mainportion of the guard ring towards the cathode 55, the field mitigatingportion 38 serving to further reduce the peak electric field duringreverse bias operation. In the implementation shown in FIG. 12, thefield mitigating portion 38 includes a slanted portion. The guard ring33 can have the same structure as any of the guard rings describedpreviously for transistors, such as any of the guard ring structuresshown in FIGS. 5-8. For example, at least a portion of the guard ringcan directly contact the underlying semiconductor material, as in FIGS.6-8.

FIG. 14 is a flow diagram of a process 1400 for manufacturing a diodeincluding a guard ring 33. The process 1400 may be performed, forexample, to create the example diode of FIGS. 12-13.

A semiconductor material layer including a conductive channel is formedon a substrate (step 1402). For example, a series of III-N layersincluding a channel layer and a barrier layer may be formed on thesubstrate, resulting in the formation of a 2DEG in the channel layer.The III-N layers may be grown epitaxially, e.g., by MOCVD, MBE, HVPE, oranother method.

An insulating layer is formed on top of the semiconductor material layer(step 1404). For example, the insulating layer may be grown or depositedby MOCVD, PECVD, high temperature CVD (HTCVD), sputtering, evaporation,or another method. In some embodiments, the insulating layer is formedby a similar or the same method as the semiconductor material layer, andcan be formed in the same step. For example, the semiconductor materiallayer and the insulating layer can all be deposited or grown by MOCVD.

An anode and a cathode are added to the transistor (step 1406). Theanode and the cathode contact the conductive channel in thesemiconductor material layer. For example, the insulating layer may beremoved in regions to receive the anode and cathode, and then the anodeand cathode may be formed by evaporation, sputtering, PECVD, HTCVD, oranother method. In some implementations, the cathode is formed prior tothe formation of the insulating layer. In other implementations, theinsulating layer includes a first portion and a second portion, thefirst portion being formed prior to formation of the cathode, and thesecond portion being formed after formation of the cathode.

The insulating layer is etched to receive a deposition of conductivematerial (step 1408). The insulating layer is etched to define regionsto receive a one or more guard rings. The guard rings are between theanode and the cathode. In some implementations, the guard ring is adistance from the anode where a depletion region in the semiconductormaterial layer would extend prior to or at breakdown of the diode. Insome implementations, the insulating layer is etched to define a regionto receive a field plate.

Conductive material is deposited over the insulating layer to form oneor more guard rings (step 1410). The guard rings may be, for example,any of the guard rings 33 illustrated in FIGS. 4-8 and 12-13. Each guardring is electrically isolated from the anode and the cathode. At least aportion of the insulating layer can be between at least a portion ofeach guard ring and the semiconductor material layer. In someimplementations, conductive material is deposited over the insulatinglayer to form a field plate.

A number of implementations have been described. Nevertheless, it willbe understood that various modifications may be made without departingfrom the spirit and scope of the techniques and devices describedherein. Accordingly, other implementations are within the scope of thefollowing claims.

What is claimed is:
 1. A semiconductor diode comprising: a semiconductormaterial layer; a conductive channel in the semiconductor materiallayer; a cathode and an anode, the cathode contacting the conductivechannel; an insulating layer on a surface of the semiconductor materiallayer; and a guard ring above the semiconductor material layer andbetween the cathode and the anode, the guard ring comprising anelectrically conductive material which is electrically isolated from thecathode and the anode.
 2. The semiconductor diode of claim 1, wherein aportion of the insulating layer is between at least a portion of theguard ring and the semiconductor material layer.
 3. The semiconductordiode of claim 1, wherein the guard ring comprises a field mitigatingportion.
 4. The semiconductor diode of claim 3, wherein the fieldmitigating portion comprises electrically conductive material extendingfrom the guard ring towards the cathode.
 5. The semiconductor diode ofclaim 3, wherein the field mitigating portion is slanted, being formedaround a via in the insulating layer that is narrower towards the bottomof the insulating layer and wider towards the top of the insulatinglayer.
 6. The semiconductor diode of claim 1, wherein the guard ring isnot electrically connected to any DC and AC voltage sources.
 7. Thesemiconductor diode of claim 1, further comprising a field plate.
 8. Thesemiconductor diode of claim 7, wherein the field plate is electricallyconnected to the anode.
 9. The semiconductor diode of claim 7, whereinthe field plate comprises electrically conducting material contactingthe anode and extending from the anode towards the cathode over the topof the insulating layer.
 10. The semiconductor diode of claim 7, whereinthe field plate is slanted, being formed around a via in the insulatinglayer that is narrower towards a bottom of the insulating layer andwider towards a top of the insulating layer.
 11. The semiconductor diodeof claim 1, wherein the guard ring extends from a top of the insulatinglayer towards a bottom of the insulating layer without contacting thesemiconductor material layer.
 12. The semiconductor diode of claim 1,wherein the guard ring extends from a top of the insulating layertowards a bottom of the insulating layer and contacts the semiconductormaterial layer.
 13. The semiconductor diode of claim 1, wherein theguard ring is a distance from the anode where a depletion region in thesemiconductor material layer extends prior to or at breakdown of thediode in a similar diode which lacks the guard ring.
 14. Thesemiconductor diode of claim 1, wherein the diode is a III-N device. 15.The semiconductor diode of claim 1, wherein the diode is a high-voltagedevice.
 16. A method of manufacturing a semiconductor diode, the methodcomprising: forming a semiconductor material layer on a substrate;forming an insulating layer on top of the semiconductor material layer;adding a cathode and an anode, the cathode contacting a conductivechannel in the semiconductor material layer; etching the insulatinglayer to receive a deposition of conductive material; and depositingconductive material to form a guard ring between the cathode and theanode, wherein the guard ring is electrically isolated from the cathodeand the anode.
 17. The method of claim 16, wherein a portion of theinsulating layer is between at least a portion of the guard ring and thesemiconductor material layer
 18. The method of claim 16, wherein theguard ring comprises a field mitigating portion.
 19. The method of claim18, wherein the field mitigating portion comprises electricallyconductive material extending from the guard ring towards the cathode.20. The method of claim 18, wherein the field mitigating portion isslanted, being formed around a via that is narrower towards the bottomof the insulating layer and wider towards the top of the insulatinglayer.
 21. The method of claim 16, wherein the guard ring is notelectrically connected to any DC and AC voltage sources.
 22. The methodof claim 16, wherein etching the insulating layer comprises etching theinsulating layer to define a field plate.
 23. The method of claim 22,wherein the field plate is electrically connected to the anode.
 24. Themethod of claim 22, wherein the field plate comprises electricallyconducting material contacting the anode and extending from the anodetowards the cathode over the top of the insulating layer.
 25. The methodof claim 22, wherein the field plate is slanted, being formed around avia in the insulating layer that is narrower towards a bottom of theinsulating layer and wider towards a top of the insulating layer.